Apple has kicked off its latest product launch week with the introduction of the iPhone 17e, its newest budget-friendly smartphone. Building on the foundation of last year’s model, the device retains a familiar design while introducing meaningful performance and connectivity upgrades — all without increasing its starting price.
At the heart of the iPhone 17e is the new A19 chip, paired with a 4-core GPU that promises faster performance and improved efficiency for everyday tasks and mobile gaming. The phone also debuts Apple’s latest C1X modem, designed to enhance network stability and deliver more reliable connectivity across supported networks.
The device features a 6.1-inch OLED display with a 2532 x 1170 resolution and a 60Hz refresh rate. Apple has upgraded durability with the introduction of Ceramic Shield 2 protection, aimed at improving resistance to drops and scratches. The display retains the familiar notch design that houses the Face ID system and a 12MP front-facing camera for selfies and video calls.
On the rear, the iPhone 17e is equipped with a single 48MP camera featuring optical image stabilization. The camera supports 4K video recording at 60 frames per second with Dolby Vision. Apple says a new image processing pipeline improves portrait photography, delivering sharper subject detail and more natural background blur.
One of the most notable additions is MagSafe support, enabling compatibility with a wide range of magnetic accessories. The device supports 15W wireless charging and faster wired charging for improved convenience.
Additional features include Wi-Fi 6, Bluetooth 5.3, GPS, NFC, satellite connectivity, eSIM support, and an IP68 rating for water and dust resistance. The phone runs iOS 26 and integrates Apple Intelligence features for enhanced user experiences.
The iPhone 17e starts at $599 for the 256GB model, while the 512GB version is priced at $799. It will be available in Black, White, and a new Soft Pink color option. Pre-orders open March 4, with official availability beginning March 11.