Samsung Electronics, a global leader in semiconductor technology, has revealed its latest innovations and strategic vision for the AI era at the Samsung Foundry Forum (SFF) U.S.
The annual event, held at the company’s Device Solutions America headquarters, showcased cutting-edge developments under the theme “Empowering the AI Revolution.”
Samsung’s reinforced technology roadmap includes two new advanced nodes, SF2Z and SF4U, and the integrated Samsung AI Solutions platform, leveraging the strengths of its Foundry, Memory, and Advanced Package (AVP) businesses.
“High-performance, low-power semiconductors are essential for AI implementation,” stated Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. “Our GAA process, optimized for AI chips, will soon incorporate co-packaged optics (CPO) technology for efficient data processing, providing comprehensive AI solutions.”
Industry leaders such as Arm CEO Rene Haas and Groq CEO Jonathan Ross highlighted their partnerships with Samsung in addressing AI challenges. The event featured presentations and booths from around 30 partner companies, underscoring the collaborative spirit within the U.S. foundry ecosystem.
New Process Nodes and Advancements
Samsung announced its latest process nodes, SF2Z and SF4U, enhancing its technology roadmap. The SF2Z, a 2nm process with optimized backside power delivery network (BSPDN) technology, offers significant improvements in power, performance, and area (PPA) and is set for mass production in 2027. The SF4U, a high-value 4nm variant, incorporates optical shrink for PPA enhancements, with production slated for 2025.
Preparations for the SF1.4 (1.4nm) node are progressing, targeting mass production in 2027. Samsung also pioneering future process technologies below 1.4nm through material and structural innovations.
Maturity of GAA Technology
Samsung’s gate-all-around (GAA) technology, crucial for AI, continues to mature. In its third year of mass production, the GAA process is consistently improving in yield and performance. Samsung plans to mass produce its second-generation 3nm process (SF3) later this year and integrate GAA into its upcoming 2nm process.
Comprehensive AI Solutions
The Samsung AI Solutions platform, resulting from cross-company collaborations, integrates Foundry, Memory, and AVP strengths to offer tailored, high-performance, low-power AI solutions. This collaboration enhances supply chain management and reduces time to market, achieving a 20% improvement in total turnaround time.
Diverse Customer Base and Applications
Samsung is diversifying its customer base and application areas, with AI sales increasing by 80% over the past year. The company offers a balanced technology portfolio, catering to automotive, medical, wearable, and IoT applications, ensuring strong cost competitiveness and continued PPA improvements.
Future Ecosystem Growth
Samsung will continue to foster collaboration and innovation at the Samsung Advanced Foundry Ecosystem (SAFE™) Forum on June 13. Themed “AI: Exploring Possibilities and Future,” the forum will feature industry leaders discussing customizable AI technologies. The event will also host the inaugural Multi-Die Integration (MDI) Alliance workshop, focusing on 2.5D and 3D IC designs, strengthening partnerships, and driving collective growth.
